Publications and Talks

Learn more about our interaction and collaboration with the international scientific community and industry. The most recent publications and references are listed near the top.

2025

• Conference (Submitted) J. Hernandez-Bonilla, T. Wendt, T. Reuschel, C. Yang, and C. Schuster, "Data-Driven Prediction of Temperature-Dependent Dielectric and Conductive Parameters Based On Differential Stripline Characteristics," IEEE Workshop on Signal and Power Integrity (SPI), Gaeta, Italy, May 2025.
• Journal (Invited, Accepted) J. Hernandez-Bonilla, G. Alavi, T. Reuschel, C. Klein, A. El Ouardi, and C. Schuster, "Design Challenges for High-Speed Digital Links for Automotive Applications," IEEE Electromagnetic Compatibility Magazine.
• Conference J. Hernandez-Bonilla, G. Alavi, T. Reuschel, C. Yang, and C. Schuster, "Prediction of Dielectric Constant & Copper Roughness Parameters of High-Speed Automotive PCB Digital Interconnects Using a Data-Based Model," DesignCon, Santa Clara, CA, USA, Jan. 2025.
• Conference T. Reuschel, P. Trottier, P.T. Jayachandran, C. Watson, A. Kashcheyev, and O. Koloskov, "Review of Newly Developed Modular Ionosonde Operating in the Canadian High Arctic," National Radio Science Meeting, Boulder, CO, USA, Jan. 2025.

2024

• Talk (Invited) T. Reuschel, P. Trottier, "Development of a Modular High Frequency Measurement Platform and Its Application as Ionosonde," Workshop on Vertical Coupling in the Atmosphere-Ionosphere System (VCAIS), Fredericton, NB, Canada, Jun. 2024.
• Conference J. Hernandez-Bonilla, G. Alavi, T. Reuschel, C. Yang, and C. Schuster, "Uncertainty Quantification of the Insertion Loss of an Automotive PCB Stripline," IEEE Workshop on Signal and Power Integrity (SPI), Lisbon, Portugal, May 2024. DOI: 10.1109/SPI60975.2024.10539230
• Talk T. Reuschel, P. Trottier, P.T. Jayachandran, A. Kashcheyev, C. Watson, and D. Themens, "Improving Raw Data Quality in Ionosonde Design and Operation," Division of Atmospheric and Space Physics Workshop (DASP), Edmonton, AB, Canada, Feb. 2024.

2023

• Conference (Best Poster Paper) T. Hillebrecht, J. Alfert, T. Reuschel, and C. Schuster, "Automated Generation and Validation of Physics-Based Via Models against Full-Wave Simulation for an SI/PI Database," IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, Oct. 2023. DOI: 10.1109/EPEPS58208.2023.10314907
• Journal F. Garbuglia, T. Reuschel, D. Deschrijver, T. Dhaene, D. Spina, and C. Schuster, "Modeling Electrically Long Interconnects using Physics-Informed Delayed Gaussian Processes," IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 6, Special Issue on Advances of Computational Electromagnetics for EMC, Dec. 2023. DOI: 10.1109/TEMC.2023.3317917
• Talk T. Reuschel, P. Trottier, A. Kashchevey, and P.T. Jayachandran, "Applications of a Novel Modular High Frequency Measurement Platform in Ionospheric Observation," Ionospheric Effects Symposium (IES), Alexandria, VA, USA, May 2023.
• Conference F. Garbuglia, D. Spina, T. Reuschel, C. Schuster, D. Deschrijver, and T. Dhaene, "Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels," IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 2023. DOI: 10.1109/SPI57109.2023.10145548
• Talk C. Vanicek, T. Reuschel, and A. Kashcheyev, "Variability Assessment of High Frequency Preamplifier Performance," Division of Atmospheric and Space Physics Workshop (DASP), Montreal, QC, Canada, Feb. 2023.
• Talk T. Reuschel, P. Trottier, A. Kashcheyev, and P.T. Jayachandran, "Development of a Modular High Frequency Measurement Platform," Division of Atmospheric and Space Physics Workshop (DASP), Montreal, QC, Canada, Feb. 2023.

2019

• Talk T. Reuschel, "Impact of Geometry and Common-Mode Choke Variability on 100BASE-T1 Medium Dependent Interface," Dassault 3DExperience Conference Germany, Darmstadt, Germany, Nov. 2019.
• Book T. Reuschel, "Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards," Aachen, Germany: Shaker Verlag, 2019. ISBN 978-3-8440-6499-5. German National Library #1175756628.

2018

• Conference T. Wendt, T. Reuschel, and C. Schuster, "Direct Prediction of Linear Equalization Coefficients Using Raised Cosine Pulse Shaping in Frequency Domain," IEEE Workshop on Signal and Power Integrity (SPI), Brest, France, May 2018. DOI: 10.1109/SaPIW.2018.8401665.
• Conference (Best Paper) T. Reuschel, Ö. Yildiz, J. Balachandran, C. Filip, N. Bhagwath, B. Sen, and C. Schuster, "Efficient Sensitivity-Aware Assessment of High-Speed Links Using PCE and Implications for COM," DesignCon, Santa Clara, CA, USA, Jan. 2018. Available online: reprint.

2017

• Journal T. Reuschel, J. B. Preibisch, K. Scharff, R. Rimolo-Donadio, X. Duan, Y. H. Kwark, and C. Schuster, "Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 11, pp. 1842-1851, Aug. 2017. DOI: 10.1109/TCPMT.2017.2742703.
• Conference T. Reuschel, J. B. Preibisch, and C. Schuster, "Efficient Design of Continuous Time Linear Equalization for Loss Dominated Digital Links," IEEE Workshop on Signal and Power Integrity (SPI), Baveno, Italy, May 2017. DOI: 10.1109/SaPIW.2017.7943999.
• Conference K. Scharff, T. Reuschel, X. Duan, H.-D. Brüns, and C. Schuster, "Exploration of Differential Via Stub Effect Mitigation by Using PAM4 and PAM8 Line Coding," IEEE Workshop on Signal and Power Integrity (SPI), Baveno, Italy, May 2017. DOI: 10.1109/SaPIW.2017.7944020.
• Journal (Invited) B. Rohrdantz, T. Jaschke, T. Reuschel, S. Radzijewski, and A. F. Jacob, "An Electronically Scannable Reflector Antenna Using a Planar Active Array Feed at Ka-Band," IEEE Transactions on Microwave Theory and Techniques, vol. 65, no. 5, pp. 1650-1661, Mar. 2017. DOI: 10.1109/TMTT.2017.2663402.
• Conference Y. Zhao, R. Grünheid, G. Bauch, T. Reuschel, and C. Schuster, "Redundant and Non-Redundant Spectrum Shaping Schemes for Reflection-Limited Chip-to-Chip Communication," ITG Conference on Systems, Communication and Coding (SCC), Hamburg, Germany, Feb. 2017. IEEE Xplore.
• Conference (Best Paper) J. B. Preibisch, T. Reuschel, K. Scharff, J. Balachandran, B. Sen, and C. Schuster, "Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE," DesignCon, Santa Clara, CA, USA, Jan. 2017.

2016

• Journal (Best Paper) D. Dahl, T. Reuschel, J. B. Preibisch, X. Duan, I. Ndip, K.-D.- Lang, and C. Schuster, "Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 12, pp. 1889-1898, Dec. 2016. DOI: 10.1109/TCPMT.2016.2620059.
• Journal A. Vogt, T. Reuschel, H.-D. Brüns, S. Le Borne, and C. Schuster, "On the Treatment of Arbitrary Boundary Conditions Using a Fast Direct H-Matrix Solver in MoM," IEEE Transactions on Antennas and Propagation, vol. 64, no. 8, pp. 3670-3676, Aug. 2016. DOI: 10.1109/TAP.2016.2570803.
• Conference T. Reuschel, M. Kotzev, D. Dahl, and C. Schuster, "Modeling of Differential Striplines in Segmented Simulation of Printed Circuit Board Links," IEEE Signal and Power Integrity Conference (SIPI 2016), Ottawa, ON, Canada, Jul. 2016. DOI: 10.1109/ISEMC.2016.7571772.
• Conference D. Dahl, T. Reuschel, X. Duan, I. Ndip, K.-D. Lang, and C. Schuster, "On the Upper Bound of Total Uncorrelated Crosstalk in Large Through Silicon Via Arrays," IEEE Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 2016. DOI: 10.1109/SaPIW.2016.7496309.
• Conference J. B. Preibisch, T. Reuschel, K. Scharff, and C. Schuster, "Impact of Continuous Time Linear Equalizer Variability on Eye Opening of High-Speed Links," IEEE Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 2016. DOI: 10.1109/SaPIW.2016.7496287.
• Journal T. Reuschel, S. Müller, and C. Schuster, "Segmented Physics-Based Modeling of Multilayer Printed Circuit Boards Using Stripline Ports," IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 1, pp. 197-206, Feb. 2016. DOI: 10.1109/TEMC.2015.2481001.
• Conference Y. H. Kwark, T. Reuschel, R. Rimolo-Donadio, D. Kaller, T.-M. Winkel, H. Harrer, and C. Schuster, "Systematic Analysis of Electrical Link Bottlenecks and Strategies for Their Equalization," DesignCon, Santa Clara, CA, USA, Jan. 2016.

2015

• Talk T. Reuschel, "Fahren mit Strom – Wie geht das? (Electromobility – How does that work?)," Kinder-Uni Winsen (Lectures for Children Winsen), Winsen (Luhe), Germany, Nov. 2015.
• Journal S. Müller, T. Reuschel, R. Rimolo-Donadio, Y. H. Kwark, and C. Schuster, "Energy-Aware Signal Integrity Analysis for High-Speed PCB Links," IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 5, pp. 1226-1234, Oct. 2015. DOI: 10.1109/TEMC.2015.2427362.

2009–2014

• Conference (Best Student Paper Finalist) T. Reuschel, S. Müller, H.-D. Brüns, and C. Schuster, "Investigation of Long Range Differential Crosstalk on Printed Circuit Boards," IEEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium, May 2014. DOI: 10.1109/SaPIW.2014.6844525.
• Talk T. Reuschel and C. Schnabel, "Faszination Schiff — Sicher unterwegs (Ships — Safe On Our Way)," Faszination Technik, Vorlesungsreihe für Kinder (Lectures for Children), Hamburg, Germany, Sept. 2012.
• Conference T. Reuschel and A. Salehian, "Modeling and Evaluation of a Hybrid Piezo-Electromagnetic Vibrating Energy Harvesting Device," Proc. of AIP Conference, Vol. 1368, No. 1, pp. 81–84, 2011. [Presented at International Conference on Applied Mathematics, Modeling, and Computational Science (AMMCS), Waterloo, Ontario, Canada, July 2011.] DOI: 10.1063/1.3663465.
• Talk T. Reuschel and D. Timmermann, "Tutorium Einführung in die Programmierung für Studierende (Introduction to Computer Programming for Undergraduate Students)," Hamburg University of Technology (TUHH), Hamburg, Germany, Okt. 2009 and Apr. 2010.